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EPO-TEK- H20S Electrical Epoxy
ID
AVETH20S
EPO-TEK™H20S is a modified version of EPO-TEK™H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK™H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short
Description
EPO-TEK™H20S is a modified version of EPO-TEK™H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK™H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK™H20S is extremely simple to use.
| Electrical |
|
| Electrical, Thermal |
|
| Oven, Snap |
|
| 2 | |
| 3 days | |
| 1,800-2,800cPs @ 100 rpm |
|
| =80°C | |
| 5 | |
| 175°C/45 sec 150°C/5 min 120°C/15 min 100°C/45 min 80°C/90 min |
|
| =5 kg | |
| 3.25 W/mK | |
| 31 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 64D | |
| N/A |
|
| Electronics Assembly, Hybrid, Medical, Semiconductor, Solar |
|
| Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, Medical Epoxies, PCB Level Materials, Semiconductor , Solar, Solder Replacement, Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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